1. 2. 3. material content data sheet sales product name bsz031ne2ls5 issued 7. september 2015 ma# ma001303676 package pg-tsdson-8-25 weight* 34.44 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.226 0.66 0.66 6556 6556 leadframe non noble metal zinc 7440-66-6 0.015 0.04 422 inorganic material phosphorus 7723-14-0 0.004 0.01 106 non noble metal iron 7439-89-6 0.291 0.84 8442 non noble metal copper 7440-50-8 11.804 34.28 35.17 342781 351751 wire non noble metal copper 7440-50-8 0.014 0.04 0.04 404 404 encapsulation organic material carbon black 1333-86-4 0.036 0.11 1059 plastics epoxy resin - 1.879 5.46 54555 inorganic material silicondioxide 60676-86-0 16.325 47.41 52.98 474050 529664 leadfinish non noble metal tin 7440-31-5 0.400 1.16 1.16 11622 11622 plating noble metal silver 7440-22-4 0.020 0.06 0.06 590 590 solder noble metal silver 7440-22-4 0.010 0.03 281 non noble metal tin 7440-31-5 0.008 0.02 225 non noble metal lead 7439-92-1 0.369 1.07 1.12 10729 11235 heat sink clip inorganic material phosphorus 7723-14-0 0.001 0.00 26 non noble metal zinc 7440-66-6 0.004 0.01 106 non noble metal iron 7439-89-6 0.073 0.21 2116 non noble metal copper 7440-50-8 2.959 8.59 8.81 85930 88178 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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